PIC32 QFN-44 exposed pad

[Simon (Gast)]

Niergends im Datenblatt auch nur ein wort zu dem exposed pad unter dem
QFN44-8x8 Gehäuse.

PIC32MX250F128D-I_ML


Was wird damit gemacht? mit GND verbinden?

[Simon (Gast)]

hab was gefunden:

Below is a response from Microchip Engineering Support Team for your 
submitted ticket #: 1-142690.

 Problem Resolution:
The exposed pads in QFN (any) packages parts increase the maximum power 
dissipation of the packages. When an exposed pad is offered as an 
option, it is specifically to increase the power dissipation 
capabilities of the IC package. In most applications, the exposed pad is 
connected to ground. Hence the center pad can be connected electrically 
to ground without any harm in the PCB. As far the potential of the pad 
is concerned, it is not connected anywhere hence no potential.

[Andreas H. (ahz)]

Simon schrieb:
> Niergends im Datenblatt auch nur ein wort zu dem exposed pad unter dem
> QFN44-8x8 Gehäuse.
>
> PIC32MX250F128D-I_ML
>
> Was wird damit gemacht? mit GND verbinden?

Lies doch einfach mal das RICHTIGE Datenblatt ;-)

PIC32MX1XX/2XX Family Data Sheet, Seite 9, Fußnote 3:
"The metal plane at the bottom of the device is not connected to any 
pins and is recommended to be connected to VSS externally"

Und bevor Du fragst:
http://ww1.microchip.com/downloads/en/DeviceDoc/61168E.pdf

Gruss
Andreas

[Simon (Gast)]

genau das Datenblatt hab ich hier, ooooh man, na gut Danke!